X-Scan Imaging Corporation manufactures a family of single-chip CMOS silicon photo-diode buttable array detectors with on-chip, fully integrated signal processing circuits designed for visible wavelength and X-ray imaging applications. A scintillator layer is attached to the surface of the detector array, which converts X-ray photons into visible light. A variety of standard x-ray sensitive scintillator materials are available for applications in industrial inspection, airport security and cargo screening.
Each detector series is configured as a contiguous linear array of photodiodes including, a timing generator, digital scanning shift register, an array of charge integrating amplifiers, sample-and-hold circuits, and signal amplification chain. It is designed to permit end-to-end butting on a printed circuit board to form a single longer detector array for extended length scanning applications.
The complete family of detector modules is listed in the following table:
